Electronic Potting Epoxy Resin

Electronic Potting Epoxy Resin for sealing modules, sensors, and power components. OEM/ODM custom formulas, stable supply, and factory support.

High Hardness Thermal Conductive Epoxy Potting Compound for Power Supply Electronic Module Encapsulation

$3.54-4 /kilograms

Price varies depending on material, logo, quantity and customization requirements.

MOQ 30 kilograms
Model NO. resin-1148
Service OEM / ODM
Quality You Can Trust
Flexible & Scalable Solutions
Customizable Product Options
Comprehensive Specifications
Your Reliable Business Partner

Introduction

分类双组分粘合剂应用领域电子, Electronics & Electrical
主成分滴胶CAS编号科翔-1005
原产地Fujian, China别名环氧树脂灌封胶
类型环氧树脂AB胶

We are a professional manufacturer and supplier, dedicated to maintaining consistent quality and establishing long-term partnerships with clients worldwide.

Our mission is to provide high-quality products and reliable service. We are committed to offering the following advantages:

  • Stable production system ensuring consistent quality, dependable supply, and standardized manufacturing management;
  • Strict quality control covering material selection, processing, surface finishing, and final packaging;
  • Variety of products and specifications to meet diverse project requirements and application scenarios;
  • OEM & customization support based on drawings, samples, or specific technical requirements;
  • Flexible packaging solutions to ensure safe handling and transportation of products;
  • Continuous improvement in products and services to better support customers in different markets.

If you are interested in our products, please feel free to contact us. We look forward to establishing long-term and mutually beneficial cooperation with you.

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High Hardness Thermal Conductive Epoxy Potting Compound for Power Supply Electronic Module Encapsulation

SKU: resin-1148

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